| Place of Origin: | SUZHOU |
|---|---|
| Brand Name: | PHOENIX |
| Certification: | LM80 CE ROHS |
| Model Number: | 3030 |
| Minimum Order Quantity: | 4000PCS |
| Price: | Negotiation |
| Packaging Details: | 4000PCS /ROLL |
| Delivery Time: | 7-10 DAYS |
| Payment Terms: | Western Union, MoneyGram, T/T |
| Supply Ability: | 800KK PER MONTH |
| Name: | SMD LED 3030 White Color | Application: | Spotlighting |
|---|---|---|---|
| Luminous Flux(lm): | 150-160lm | Nput Voltage(V): | 54V |
| Power: | 1w | Color Rendering Index(Ra): | 80 |
| Cct: | 2700-6500k | Working Time (hours): | 20000 |
| Warranty(Year): | 3 Years | Operating Temperature(℃): | -40-85 |
| High Light: | 54v 3030 LED Chip,Warm White 3030 LED Chip,3030 smd led chips |
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Application Introduction:
In the electronic industry, backlight is a form of lighting, which is often used in LCD display. The difference between backlight and front light is that the backlight shines from the side or back, while the front light shines from the front as the name suggests. They are used to increase the illumination in low light source environment and the brightness on computer monitors and LCD screens to produce light in a similar way to CRT displays.
SMD LED chip 3030 54v 20ma
Quick details:
| Input Voltage(V): | 54V |
| Warranty(Year): | 3-Year |
| Type: | Smd Led Chip 3030 |
| Lighting solutions service: | Lighting and circuitry design |
| Luminous Efficacy(lm/w): | 160LM |
| Lifespan (hours): | 50000 |
| Working Time (hours): | 20000 |
| Chip Material: | INGAN |
| Emitting Color: | Warm White/Natural White/COOL WHITE |
| Power: | 1W |
| Viewing Angle(°): | 120 Degree |
| Color Rendering Index(Ra): | 80 |
| Color Temperature: | 2700-6500K |
| Place of Origin: | Suzhou ,jiangsu |
| Application: | Spotlighting |
| Package Type: | Suface Mount Package |
| Forward Current: | 20MA |
| Size: | 3.0*3.0*0.6mm |
| Packing: | 4000 Pcs/Roll |
Product specification:
Package Structure:
Absolute Maximum Ratings
| Item | Symbol | Maximum | Unit |
| Power dissipation | PD | 1 | W |
| Continuous forward current | IFmax | 20 | mA |
| Peak forward current (1/10 duty cycle 10ms pulse width) | IFP | 30 | mA |
| Reverse voltage | VR | 5 | V |
| Electrostatic Discharge (HBM) | ESD | 2000 | V |
| Operating temperature range | Topr | -40 to +85 | ℃ |
| Storage temperature range | Tstg | -40 to +85 | ℃ |
| Led yunction temperature | Tj | 125 | ℃ |
Optical/Electrical Characterization:
| Item | Symbol | Condition | Min | Typ | Max | Unit |
| Forward voltage | VF | IF=60mA | 50 | 52 | 54 | V |
| CIE | X,Y |
IF=60mA IF=60mA |
- | X=0.32 | - | |
| - | Y=0.34 | - | ||||
| CCT | IF=60mA | 2700 | 4000 | 6550 | K | |
| Viewing Angle | 2θ1/2 | IF=60mA | - | 120 | - | Deg |
| Luminous Intensity | IV | IF=60mA | 120 | 160 | LM | |
| CRI | RA | IF=60mA | 80 | RA | ||
| Reverse Current | Ir | Vr=5V | 0 | 1 | uA | |
| Thermal resistance | Rth(j-s) | IF=60mA | 28 | ℃/W |
Typical Electro-Optical characteristics curves:
LED Reliability Test List
| No. | Item | Test Conditions |
Test hr/cycle/time |
Sample Q’ty |
Ac∕Re | |
| 1 | Solder Heat | TEMP:260℃±5℃；5±1 sec | 2 times | 30 pcs | 0∕1 | |
| 2 | Solder ability Test ※ | TEMP:235℃±5℃；3±1 sec | 1 time | 5 pcs | 0∕1 | |
| 3 | Temperature Cycle |
H:+100℃ 30min. ∫5min. L:-40℃ 30min. |
100 cycles | 20 pcs | 0∕1 | |
| 4 | Thermal Shock |
H:+100℃ 5min. ∫ L:-40℃ 5min. |
50 cycles | 20 pcs | 0∕1 | |
| 5 | High Temperature Storage | TEMP:100℃ | 1000 hrs | 20 pcs | 0∕1 | |
| 6 | Low Temperature Storage | TEMP:-40℃ | 1000 hrs | 20 pcs | 0∕1 | |
| 7 | DC Operating Life | IF＝IFmax | 1000 hrs | 20 pcs | 0∕1 | |
| 8 |
High Temperature High Humidity |
85℃∕85％R.H. | 1000 hrs | 20 pcs | 0∕1 | |
| 9 | Shocking test |
100～2000Hz ；98.1m/s2 X,Y,Z direction |
2 hrs | 20 pcs | 0∕1 | |
| 10 | Dropping test | Put on pallet ；height:75cm | 3 times | 20 pcs | 0∕1 | |
| Judgment Criteria | ||||||
| Forward Voltage VF | VF Max-Increase < 1.1x | |||||
| Reverse Current IR | IR Max-Increase < IRmax | |||||
| Luminous Intensity IV | IV Decay < 40% | |||||
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※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours) |
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Packaging:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.
Soldering iron :
When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Handling Precautions :
Handle the component along the side surface by using forceps or appropriate tools
Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry
Do not stack together assembled PCBs containing LEDs. Impact may scratch the silicone lens or damage the internal circuitry
Product features:
Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation
High brightness ,low attenuation high color rendering
Minimum 70,80,90 95 CRI options
Strong welding and good stability undead light
Product series and company logo on the front
CE ROHS LM80 Certification
Production Process:
